EPCOSArchive
AUGUST
Aug 25th, 2011
TDK-EPC, a group company of TDK Corporation, presents the TDK MLG0603S series of multilayer ceramic coils with the world’s highest inductance values*. These 0603 inductors feature an inductance of up to 180 nH at 100 MHz. Mass production started in August 2011.
Aug 18th, 2011
TDK-EPC, a group company of TDK Corporation, presents the new TDK TFSQ0402 series of thin-film capacitors in a 0402 (EIA 01005) package. Under the product name Z-match the new capacitors are designed for power amplifier circuits and RF matching circuits in smartphones, mobile phones, wireless LANs and other communication technologies. Mass production started in August 2011.
Aug 4th, 2011
- High-Speed, Long-Life SATA Flash Drive Uses TDK GBDriver RS3 SATA Controller ICs
Auto-Refresh Functions and Internal Power Supply Backup Protection Circuit Provide
High Tolerance Against Power Supply Problems -
Auto-Refresh Functions and Internal Power Supply Backup Protection Circuit Provide
High Tolerance Against Power Supply Problems -
JULY
Jul 28th, 2011
TDK-EPC, a group company of the TDK Corporation, has intensified its support of STMicroelectronics, one of the world’s largest semiconductor companies, in the creation of tested energy-saving solutions for their customers’ applications. ST just recently completed the development of the 50th joint reference design in the past year, predominantly for power supplies. These reference designs combine state-of-the-art ICs from ST and passive electronic components from TDK-EPC.
Jul 14th, 2011
TDK-EPC Corporation, a group company of TDK Corporation, presents the TDK MLP2012V series of low-profile and energy efficient multilayer power inductors that help to reduce power dissipation in portable devices such as smartphones, mobile phones and digital cameras. Production begins in July 2011.
MAY
May 31st, 2011
TDK Corporation has started mass production of a newly developed see-through passive matrix type QVGA organic EL display (product name: UEL476) from this Spring, a world's first*.
Organic EL displays are formed through thin-film techniques, using organic material that emits light in response to an electric current. High brightness, wide viewing angle and other favorable characteristics make this display type very easy on the eye, and since it also achieves fast response, Organic EL displays have been adopted for wider use in flat panel displays. All organic EL displays from TDK employ the passive matrix principle. The newly developed see-through type is mainly intended for use as the main display panel in mobile phones and other mobile devices.
Organic EL displays are formed through thin-film techniques, using organic material that emits light in response to an electric current. High brightness, wide viewing angle and other favorable characteristics make this display type very easy on the eye, and since it also achieves fast response, Organic EL displays have been adopted for wider use in flat panel displays. All organic EL displays from TDK employ the passive matrix principle. The newly developed see-through type is mainly intended for use as the main display panel in mobile phones and other mobile devices.
May 12th, 2011
TDK-EPC Corporation, a group company of TDK Corporation, completed development of the SPM6530-H SMD power inductor series with an extended temperature range. The new TDK power inductors are now rated for temperatures of up to 125 °C and currents up to 28.5 A. The components are thus suitable for use as choke coils in the DC-DC converters of automotive brake systems, headlights, and engine control units (ECU). Mass production began in April 2011.
May 12th, 2011
TDK-EPC Corporation, a group company of TDK Corporation, developed the VLM13580-D1 and DR SMD power inductors with an extended operating temperature range and increased rated current. Thus, the new TDK power inductors are suitable for use as choke coils in the DC-DC converters of automotive engine control units (ECU). Mass production of the D1 and DR specification inductors is scheduled to begin in October 2011.
APRIL
Apr 21st, 2011
TDK Corporation announced today the development of the GBDriver RS3 series of Serial ATA (SATA) 3 Gbps compatible NAND flash memory controller ICs. Sales are scheduled to begin in July.
The new TDK GBDriver RS3 series are high-speed SATA controller ICs that support high-speed access with an effective speed of 170 Mbyte/second. In addition to the existing 2 Kbyte/page and 4 Kbyte/page structures, they support the latest 8 Kbyte/page SLC (single-level cell) and MLC (multi-level cell) NAND flash memories and can realize high-speed SATA storage ranging from 128 Mbyte to 128 Gbyte. As a result, the GBDriver RS3 series can be used for a wide range of applications from SATADOM*1 other embedded storage to mobile internet devices such as smart phones or audiovisual devices such as smart televisions and Blu-ray disc players. The controllers are available in a 120-pin TQPF package and a 144-pin VFBGA package.
The new TDK GBDriver RS3 series are high-speed SATA controller ICs that support high-speed access with an effective speed of 170 Mbyte/second. In addition to the existing 2 Kbyte/page and 4 Kbyte/page structures, they support the latest 8 Kbyte/page SLC (single-level cell) and MLC (multi-level cell) NAND flash memories and can realize high-speed SATA storage ranging from 128 Mbyte to 128 Gbyte. As a result, the GBDriver RS3 series can be used for a wide range of applications from SATADOM*1 other embedded storage to mobile internet devices such as smart phones or audiovisual devices such as smart televisions and Blu-ray disc players. The controllers are available in a 120-pin TQPF package and a 144-pin VFBGA package.
MARCH
Mar 31st, 2011
TDK-EPC, a Group company of the TDK Corporation, has extended its range of power factor controllers with a heavy duty version of the EPCOS BR6000 controller. The new EPCOS BR6000-HD is particularly well suited for applications that place high demands on EMC (electromagnetic compatibility). The new controller can also be used in a significantly extended temperature range from -40 to +80 °C. This compares well with conventional controllers, which operate across a smaller temperature range of between -20 and +60 °C.
Mar 17th, 2011
TDK-EPC, a group company of the TDK Corporation, has extended its range of power factor correction (PFC) capacitors: the EPCOS PhaseCap® Compact series now also includes types with voltages of 690, 800, 900 and 1000 V. The capacitors of the B25673A*A* series offer PFC values of between 5 kvar (50 Hz) and 33 kvar (60 Hz) at capacitance values of between 3 x 11 and 3 x 55 µF. Thanks to their compact design with diameters of only 116 and 136 mm at insertion heights of 164 and 200 mm, these capacitors are particularly useful for designing space-saving PFC systems for industrial networks.
FEBRUARY
Feb 17th, 2011
TDK-EPC, a group company of the TDK Corporation, has developed a TDK multilayer ferrite coil (MLZ2012-H series) in case size EIA 2012 with a rated current that is 2.5 times higher than existing products. With a current capability of up to 700 mA at 1.0 μH and dimensions of just 2.0 x 1.25 x 1.25 mm³, the MLZ2012-H series is ideally suited for decoupling in compact electronic devices such as notebook computers and digital still and video cameras. Mass production of the coil begins in February 2011.
Feb 10th, 2011
TDK-EPC, a group company of the TDK Corporation, presents a new sample kit of EPCOS current-compensated ring core power chokes. These EMC components are designed for a voltage of 250 V AC and offer current capabilities of between 0.4 and 6.0 A. Their induct-ances are between 0.2 and 39 mH.
NOVEMBER
Nov 9th, 2010
TDK-EPC, a group company of the TDK Corporation, presents a range of TDK multilayer ceramic capacitors (MLCCs) with new soft terminations that provide very high resistance to mechanical and thermal stress. The new series of X7R MLCCs is designed for use in safety-critical automotive applications such as ABS, ESP and airbag systems with very high reliability demands. The high-performance soft terminations of the components form an extremely reliable joint with the circuit board, and thus help system developers achieve the very low failure rates demanded by automotive OEMs.
SEPTEMBER
Sep 30th, 2010
TDK Corporation, headquartered in Tokyo, Japan, will unveil a brand-new (giant) billboard at Munich Airport on October 1, its first ever corporate billboard in Germany as a global electronic component maker. The new billboard will be located prominently at the boarding gate of Terminal 2. The Munich initiative follows the high-tech renewal of the LED billboard in London’s Piccadilly Circus, completed in August 2010.
Sep 16th, 2010
TDK-EPC, a group company of the TDK Corporation, presents its newly developed TDK Flexield family of IRJH3 magnetic sheets. The new sheets exhibit outstanding performance in suppressing the electromagnetic noise radiated by the ICs and flexible printed circuit boards of electronic devices. Mass production is scheduled to begin in October 2010.
AUGUST
Aug 19th, 2010
TDK-EPC, a group company of the TDK Corporation, presents a new sample kit of EPCOS current-compensated ring core power chokes. These EMC components are designed for a voltage of 250 V AC and offer current capabilities of between 0.4 and 6.0 A. Their induct-ances are between 0.2 and 39 mH.
Aug 2nd, 2010
August 2, 2010
TDK Corporation of Japan introduces high-performance LED technology to its iconic billboard in London’s Piccadilly Circus on August 3 2010, opening up new possibilities for this world-famous London landmark. The new technology will allow the use of high-quality moving images in full-colour, helping to catch the attention of passersby and to increase awareness of TDK.
TDK Corporation of Japan introduces high-performance LED technology to its iconic billboard in London’s Piccadilly Circus on August 3 2010, opening up new possibilities for this world-famous London landmark. The new technology will allow the use of high-quality moving images in full-colour, helping to catch the attention of passersby and to increase awareness of TDK.
JULY
Jul 22nd, 2010
TDK-EPC, a group company of the TDK Corporation, presents a new standard series of splitter transformers from EPCOS for DSL applications. The series comprises 8 inductance values ranging from 1 to 10 mH.
Jul 8th, 2010
TDK-EPC, a group company of the TDK Corporation, has extended its range of power factor correction (PFC) capacitors. The EPCOS PhaseCap® Compact series now also comprises types for voltages from 415 V AC, 440 V AC, 480 V AC and 525 V AC. As an alternative to capacitors with dimensions of 136 mm x 200 mm (D x H), types with dimensions of only 116 mm x 224 mm or 116 mm x 248 mm are now also available, depending on the reactive power that must be compensated.
JUNE
Jun 1st, 2010
TDK Corporation has recently completed a dedicated anechoic chamber building within the grounds of the company's Technical Center in Ichikawa, Chiba Prefecture. Construction was begun in October 2008, and the facility will start operations from June of this year.
MAY
May 12th, 2010
TDK-EPC, a group company of the TDK Corporation, presents the EPCOS MiniCell™ series of pressure sensor transmitters, now with an extended range. Now these smallest media-separated differential pressure transmitters worldwide are available for unsymmetrical measurement ranges from 0 to 500 hPa and 0 to 2500 hPa. In addition, variants are offered for symmetrical measurements from -500 to +500 hPa and -2500 to +2500 hPa.
APRIL
Apr 22nd, 2010
TDK-EPC, a group company of the TDK Corporation, has introduced a family of flexible RFID magnetic polymer sheets that can be shaped to the precise specifications set by manufacturers of RFID stickers and other emerging RFID device types.
Apr 8th, 2010
TDK-EPC, a group company of the TDK Corporation, introduces the world’s first thin-film common mode filter (TCE1210) with both high-speed differential transmission common mode noise suppression and ESD protection in a single component. Mass production is scheduled to begin in April 2010.
Apr 6th, 2010
TDK-EPC, a group company of the TDK Corporation, presents a complete measurement system from EPCOS for the measurement and storage of electrical parameters in 3-phase low voltage grids. The MC7000-3 is designed for measuring voltages in the ranges from 3 x 30 V AC to 440 V AC (L-N) and 3 x 50 V AC to 690 V AC (L-L) at 50 Hz or 60 Hz. Currents of up to 3000 A can be recorded with the aid of a clamp-on ammeter.
Apr 1st, 2010
TDK-EPC, a group company of the TDK Corporation, announces the development of the MLG0402Q series of TDK multilayer ceramic coils in 0402 with a Q factor of 15.8 at 1 GHz and 10 nH. This is the world’s best* and 40 percent higher than existing products. Mass production is scheduled to start in April 2010.
MARCH
Mar 18th, 2010
TDK-EPC, a Group Company of TDK Corporation, presents the new PCC™ (Power Capacitor Chip) from EPCOS as an ideal DC-link circuit solution for the electric drives of motor vehicles. The B25655J4307K*1 and B25655J4507K*5 types were developed specifically for reference designs of the IGBT modules HybridPACK™1 (up to 20 kW) and Hybrid-PACK™2 (up to 90 kW) from Infineon Technologies. The PCCs are also contained in the new evaluation kits from Infineon. Depending on the power output, the inverter modules are suited for mild hybrid drives or for full electric drives. These modules are the only solutions currently in volume production.
Mar 11th, 2010
TDK-EPC, a group company of TDK Corporation, has developed a series of TDK pulse transformers in SMD design for LAN use. The new product enables customers to employ automated placement of all components on the circuit board and using reflow solder and thus simplify their manufacturing processes. With an inductance of at least 200 μH and an inser-tion loss of not more than 1.5 dB, the new ALT4532-001T series of pulse transformers features the similar electrical properties as its predecessor product. Mass production began in February 2010.
Mar 5th, 2010
TDK-EPC, a group company of TDK Corporation, presents the smallest commercially available MEMS microphone worldwide with an integrated digital interface. The dimensions of the EPCOS T4030 of only 3.25 × 2.25 × 1.1 mm³ make the microphone about 60 percent smaller than alternative products. This allows significantly more compact designs of mobile phones and consumer electronics applications such as MP3 players and digital cameras.
FEBRUARY
Feb 25th, 2010
TDK-EPC Corporation, a group company of TDK Corporation, presents a new series of multilayer ceramic capacitors (MLCC) with C0G temperature characteristics and a rated voltage of 50 V. Mass production began in December, 2009. The new series of TDK MLCCs are 60 percent or one size smaller than existing products with the same capacitance. With three times the capacitance* of existing TDK MLCCs, the new products will have the world’s highest capacitance in the 50 V rated voltage range for C0G.
DECEMBER
Dec 18th, 2009
TDK-EPC, a group company of the TDK Corporation, presents a sample kit with the SHCV series (super high capacitance varistors) of components from EPCOS for protection from overvoltage (ESD) and attenuation of radio frequency interference (RFI).
Dec 3rd, 2009
TDK-EPC, a group company of TDK Corporation, presents a new sample kit with EPCOS SMD CU varistors. The electrical parameters of these CTVS (ceramic transient voltage suppression) components correspond to the leaded disk varistors of the proven EPCOS series SIOV-S05 in case size 3225 and SIOV-S07 in case size 4032.
NOVEMBER
Nov 19th, 2009
TDK-EPC, a group company of TDK Corporation, presents a new sample kit with EPCOS SMD CU varistors. The electrical parameters of these CTVS (ceramic transient voltage suppression) components correspond to the leaded disk varistors of the proven EPCOS series SIOV-S05 in case size 3225 and SIOV-S07 in case size 4032.
OCTOBER
Oct 1st, 2009
TDK-EPC Corporation was established in Japan on October 1, 2009, as a result of carving out one of the core business activities of TDK Corporation, namely the passive electronic components business. This sector of the market is undergoing drastic changes, and the ability to respond speedily to customer demands is crucial to our success. The aim in forming the new structure is to further strengthen our market position and thereby contribute to the growth of the TDK Group.
JULY
Jul 21st, 2009
TDK Electronics Europe today announced the introduction of a new generation of 100V-rated ceramic chip capacitors that offers the industry’s highest level of capacitance for mid-voltage applications in devices half the size of their predecessors.
APRIL
Apr 22nd, 2009
TDK Electronics Europe today introduced the AVF26BA12A400R201, a miniature chip varistor that uses a Ball Grid Array (BGA) terminal arrangement to reduce board mounting area by 33%.
Apr 21st, 2009
TDK Corporation announced today the development of the GBDriver RS2 Series of Serial ATA(SATA) II compatible NAND flash memory controller ICs. Sales are scheduled to begin in May.
MARCH
Mar 23rd, 2009
Designers of vehicle electronics systems and other applications with extended temperature requirements can now access an extended range of automotive-rated ceramic capacitors with the launch of the CGA Series from TDK Corporation.
FEBRUARY
Feb 3rd, 2009
TDK Corporation announced today that it has developed the TFSB1, a 1005-size thin-film band-pass filter that is just 0.3mm thick, making it the world’s smallest filter of its kind. TDK applied the thin-film technologies it developed through the manufacture of HDD magnetic heads, which are among TDK’s leading products, to create a filter that is substantially lower-profile and smaller than earlier 2012-sized products.
NOVEMBER
Nov 17th, 2008
TDK Corporation announced today that it has developed and begun mass-production of a new multilayer bandpass filter for 2.4GHz wireless LAN and Bluetooth devices.
The 1.6*0.8mm Bandpass filter has the same low-loss and high-attenuation characteristics as earlier TDK products but features a profile of just 0.55mm and a near 50% reduction in x-y volume compared to standard 2.0*1.2mm filters.
Nov 5th, 2008
TDK Corporation announced today that it has developed and begun mass-production of a new multilayer bandpass filter for 2.4GHz wireless LAN and Bluetooth devices.
The 1.6*0.8mm Bandpass filter has the same low-loss and high-attenuation characteristics as earlier TDK products but features a profile of just 0.55mm and a near 50% reduction in x-y volume compared to standard 2.0*1.2mm filters.
OCTOBER
Oct 31st, 2008
• 94.35 percent of the shares of EPCOS secured in total
• TDK and EPCOS to prepare next steps of envisaged business combination
• TDK and EPCOS to prepare next steps of envisaged business combination
Oct 22nd, 2008
TDK Corporation announced today development of the GBDriver RA8 series of NAND Flash memory controller LSI for use in consumer applications, industrial embedded system devices and IT equipment.
Oct 1st, 2008
TDK Corporation has extended its range of common-mode filters for automotive networking applications by introducing the ACT45R optimised for FlexRay networks. The new filter joins the ACT45B/S filters for CAN infrastructures, sharing TDK’s proprietary coil-core technology and enhanced coil-winding process to maximise common-mode impedance while appearing almost invisible to network traffic.
SEPTEMBER
Sep 19th, 2008
TDK Corporation announced today that it has begun mass production of three new low-profile, low ESL multilayer ceramic chip capacitors (0816 size, 1005 size, and 0510 size) with a profile of just 0.3 mm - 40% slimmer than earlier TDK products.
Sep 9th, 2008
TDK-LAMBDA has further increased its impressive high power quarter brick line up, with the addition of the all new iQL range of 1/4 Brick DC/DC power modules.
Sep 1st, 2008
TDK Corporation has announced today that it has developed a new wide-band thin-film common mode filter for EMI suppression on DisplayPort interfaces.
AUGUST
Aug 18th, 2008
TDK can now announce the update of its online design tool to feature new products and updated information. The updated tool now features components for automotive applications as well as the traditional consumer applications, opening up the tools for wider industry use.
JULY
Jul 31st, 2008
· Business Combination Agreement signed
· Combination of electronic components businesses agreed creating an industry-leading player
· Strong complementary fit across sectors and regions
· TDK to launch public tender offer for EUR 17.85 in cash per EPCOS share
· Attractive 52 percent premium over three-months average closing share price
· Combination of electronic components businesses agreed creating an industry-leading player
· Strong complementary fit across sectors and regions
· TDK to launch public tender offer for EUR 17.85 in cash per EPCOS share
· Attractive 52 percent premium over three-months average closing share price
Jul 1st, 2008
TDK Corporation can today announce the development of a new series of low-profile PFC choke transformers optimised for use in flat panel displays.
The PFC series features a 40% reduction in profile, from 27mm to 15mm, as well as a 30% reduction in volume and a 20% reduction in weight from the earlier SRW4025EC transformer series. This facilitates slimmer flat panel display designs, allowing for lower-cost mass production of expensive wall-mounted sets.
JUNE
Jun 4th, 2008
TDK Corporation has today announced the development of the GBDisk RS1 series of serial ATA (SATA) compatible industrial silicon disks with a maximum memory capacity of 16 Gbyte, for use in industrial and embedded applications.
MAY
May 7th, 2008
TDK Corporation has developed the industry's first Multilayer Ceramic Chip Capacitors (MLCCs) to offer settable Equivalent Series Resistance (ESR). ESR values can now be set to any value within a specified range to control circuit impedance in smoothing and decoupling circuitry.
APRIL
Apr 7th, 2008
The new X8R series of multilayer ceramic chip capacitors (MLCCs) from TDK offers a wider operating temperature range and reduced temperature response to enable designs targeted at harsh environments such as automotive.
MARCH
Mar 26th, 2008
VLF12060/80 power inductors from TDK feature a new physical design that effectively accommodates the effects of temperature variation for improved reliability in harsh environments, such as automotive.
Mar 19th, 2008
TDK Corporation has developed and begun mass production of the IVT series of high-reliability inverter transformers. The IVT series features a low-profile package to enable inverter designs for backlighting in slimmer Liquid Crystal Displays (LCDs). The series also features high-reliability and a wide operating temperature range, supporting LCD applications in harsh environments such as automotive.
Mar 3rd, 2008
TDK Corporation announced today that it has developed the industry’s
smallest* thin-film common-mode filter for the EMI countermeasure
requirements of high-speed data transmission.
FEBRUARY
Feb 29th, 2008
TDK Innoveta Inc. has again expanded its DC/DC converter product lineup with the addition of an 'all new' product. The iTA family of DC/DC converters features two fully regulated outputs to power both the control circuitry and the line driver ICs typical of xDSL applications.
Feb 6th, 2008
TDK Innoveta Inc. has expanded its' half brick DC/DC converter lineup with the addition of a new product family. The iHG family of DC/DC converters initial product offering includes 5V/10A, 5V/20A and 3V3/30A devices, with further products planned. Providing exceptional thermal performance, using the industry standard half brick footprint with no base plate, these DC/DC converters are ideal for engineers designing low airflow, high temperature, 48V power architectures, for telecom, wireless, industrial and many other applications.
Feb 6th, 2008
TDK Corporation announced today that it has developed and began mass production of the industry’s first* automotive clamp filter in December. The new filter is called the ZCAT08V-BK, ZCAT12V-BK.
Feb 5th, 2008
TDK Corporation announced today the development of the GBDriver RS1 Series NAND Flash memory controller LSI circuit. Sales will begin in March.
The new GBDriver RS1 is compatible with 1.5 Gbps SATA I and when functioning as a NAND Flash memory controller IC, can control the latest 4 Kbyte/page SLC (single-level cell) and MLC (multi-level cell) NAND Flash memories.
DECEMBER
Dec 5th, 2007
TDK Innoveta Inc. has added to the range of point of load converters with the launch of a new product. The iAD12016A008V provides a non-isolated, SIP, through hole mounting device, which has DOSA compatible pin out. As a POL (point of load) converter the iAD addresses a broad range of applications from telecom through industrial equipments.
NOVEMBER
Nov 8th, 2007
TDK Corporation announced today announced a SMD circulator for WiMAX base stations. This device features structural improvements that increase mounting efficiency, allow for efficient heat dispersion, and also enable flexible and streamlined board layout design.
SEPTEMBER
Sep 27th, 2007
TDK Corporation today announced the addition of a 22µF capacitor to the CKD series of 3-terminal feed-through multilayer ceramic chip capacitors. The CKD310JB0J226M is in mass production now in the same size as earlier CKD products measuring only 3.2mm × 1.6mm × 1.3mm.
Sep 5th, 2007
TDK Corporation is pleased to announce the launch the TCM2010H EMI filter array, a noise filter for high-speed data transmission lines including HDMI version 1.3 high-speed signal lines. The TCM2010H is the industry’s first array product to incorporate two filter elements into a single chip.
AUGUST
Aug 20th, 2007
TDK Corporation has announced the launch of a surface mount ceramic chip antenna for Ultra Wideband (UWB) applications. The ANT1085-4R1-01A offers enhanced in-band impedance matching stability allowing for smaller board dimensions, reduced part count and easier circuit layout.
JULY
Jul 23rd, 2007
TDK Corporation has announced the development of the AVRM0603C6R8NT101N multilayer chip varistor. The AVRM0603C6R8NT101N boasts the industry’s lowest varistor voltage for a multilayer chip varistor (6.8 V), and features a reduced footprint and profile of 0.6 mm × 0.3 mm × 0.3 mm.
JUNE
Jun 19th, 2007
TDK Innoveta Inc. launches a new range of quarter brick DC-DC converters. With very high operating efficiency over a wide range of load conditions, the iQE series has been designed to meet the growing customer demand for improved efficiency under all normal operating load conditions.
MAY
May 29th, 2007
TDK Corporation has today announced the launch of the C0402 series of MLCC capacitors. With reduced dimensions, high performance and a broad range of capacitance values, the C0402 series facilitates increased design flexibility, sleeker end products and a reduction in surface mount area.
May 15th, 2007
DK Innoveta Inc. has strengthened the recent iSA series of 1/16 Brick DC/DC Power Modules by adding to the range of low output voltage products offered. The new 3.3V/25A (82.5W), 5V/15A (75W) and 12V/6.5A (78W) devices provide exceptional thermal performance using the industry standard DOSA 1/16 brick footprint which is 44% smaller than eighth bricks.
APRIL
Apr 18th, 2007
TDK Corporation today announced two new surface-mount, common-mode filters. The ACM4520-901 and ACM4520-142 have been designed to offer maximum radiation noise suppression for power lines, audio/video applications and car multimedia.
Apr 12th, 2007
TDK Corporation announced today development of the NEOREC55 series of NdFeB sintered magnets,1 which boast the industry's highest* energy products using existing production methods. Mass production is scheduled to begin in April 2007.
Apr 11th, 2007
TDK Corporation announces the launch of the BCS1210A1L and BCS1210A1H amorphous silicon visible light sensors with amplifiers. The size of the sensor (1.2mm × 1.0mm × 0.6mm) is the smallest in the industry.*
MARCH
Mar 26th, 2007
TDK Corporation and Densei-Lambda K.K. announced today that they have jointly developed and newly-designed power line EMC filters for release under the TDK-Lambda brand name. The extensive lineup includes 234 models in 13 series. Sample shipments will begin in April 2007 and mass production will start in July.
Mar 23rd, 2007
TDK Corporation has today announced the launch of the TFC252005 series and TFC252010 series power inductors. The latest addition to the TFC family, these inductors equate to a reduction in volume of 60% compared to previous parts in the range. The TFC252005 and TFC252010 series, with a reduced footprint of 2.5mm x 2.0mm, have been designed to offer increased functionality in space-constrained devices.
Mar 12th, 2007
TDK Innoveta Inc. compliments the current family of DOSA footprint, surface mount, point of load converters (POLs) with the addition of the latest product, the iBC converter.
Mar 1st, 2007
TDK Corporation has today announced the launch of the MPZ1005S100C ferrite bead. The latest release in the MPZ1005 series, the MPZ1005100C features reduced dimensions of 0.5mm x 1mm x 0.5mm and has been designed to offer increased design possibilities for space-constrained devices. The MPZ1005S100C also benefits from a reduced weight of 1mg.
JANUARY
Jan 18th, 2007
A new series of SMD multi-layer chip capacitors featuring reduced profile height was announced today by TDK Corporation. Improved production process and a new dielectric have resulted in thinner layer thickness, giving capacitors in the CGB series a total height of either 0.50mm or 0.45mm.
Jan 9th, 2007
TDK Corporation has announced the development of the GBDriver® RA6 NAND Flash memory controller LSI. The controllers are fully compatible with earlier NAND Flash memory chips and can control the latest two-plane write Flash memories. The GBDriver® RA6 controllers can control up to eight 8-Gbit NAND Flash memory chips for a maximum of 8 GByte.
NOVEMBER
Nov 30th, 2006
TDK has announced the expansion of their EMI filter arrays portfolio with the introduction of three compact noise countermeasure components. The MEA2010LV series of components features EMI filter array and ESD countermeasure on one chip for the first time. TDK has also developed two other noise countermeasure components, specifically for mobile terminals compatible with terrestrial digital TV broadcast.
Nov 15th, 2006
TDK has announced the availability of the company’s first multilayer power inductors for high switching frequencies. The MLP2520, MLP3225 and MLP3216 feature excellent DC/AC resistance, which results in improved efficiency and stand-by time, both of which are paramount for battery driven devices. Thanks to their multilayer design, the inductors have a low profile of approx. 1mm, making them ideal for handheld applications.
Nov 13th, 2006
TDK Corporation announced today the availability of its TCM1210 Common Mode Filter that ensures excellent quality of transmission for devices using differential signal. Thanks to the wide bandwidth (cut-off frequency of 3GHz) for differential mode, the filter suppresses the radiated emission that causes interference noise but has almost no effect on high-speed differential signals. This means engineers can be assured of excellent quality in high-speed transmission of signals for communication applications such as USB.
OCTOBER
Oct 16th, 2006
TDK Corporation has developed and launched a high-performance common-mode choke coil for use in power supply noise reduction. TDK has achieved this by developing a new ferrite material with high magnetic permeability and improved high-frequency characteristics. The high-frequency characteristics provide improved noise reduction, while the high magnetic permeability has allowed TDK to reduce the component’s size by 38%. TDK has also optimised the shape of the choke coil, as well as significantly improving the inductance characteristics.
Oct 6th, 2006
TDK Corporation announced today the availability of its Single Mega Cap 1210 Chip. The chip is smaller in size in comparison to the company’s standard Mega Cap, offering the same functionalities.
AUGUST
Aug 25th, 2006
TDK Corporation announced today that it will make available the new SRW2420EG, SRW2425EG and SRW33EX in Europe. The transformers are up to 30% more compact and require up to 20% less mounting space than earlier products with the same output.
JULY
Jul 18th, 2006
TDK Corporation has announced that production of the MLG0402 chip coils, the industry's smallest* multilayer ceramic chip coils, will begin in July 2006. The inductors, designed for ultra high frequency, represent a major breakthrough in miniaturization with approximately 70% less volume and 55% less mounting area than the 0603-sized coils currently in widespread use. The components also offer an excellent inductance range, up to a maximum of 12 nH.
JUNE
Jun 7th, 2006
TDK Corporation has announced the latest addition to its AVR-M 14A2 series of array chip varistors. These small varistor arrays are ideal for cell phones, HDDs, and other portable electronic devices where customers need smaller devices that can suppress the static electricity of a high-frequency signal circuit.
MAY
May 10th, 2006
TDK has announced the development and commercialization of the ACM90V-701-2PL, the industry’s first* common-mode filter designed for in-vehicle power line conditioning. The common-mode filter offers reliability and high temperature resistance, in response to current market needs.
MARCH
Mar 27th, 2006
TDK Corporation and Densei-Lambda KK are pleased to announce the launch of a unified brand called TDK-Lambda, for power-supply products. Beginning April 1, 2006, as the first stage of the brand integration, the two companies will promote and market their products together.
FEBRUARY
Feb 28th, 2006
TDK Electronics Europe has announced the development of the TFC3008 series of high-performance power inductors. With a thickness of just 0.8 mm (3.0 × 2.6 × 0.8 mm; 0.118 x 0.102 x 0.031 inch), these inductors are designed to respond to the market demands of smaller, thinner devices. Furthermore, the TFC power inductors offer flat-inductance characteristics at the industry’s highest levels.
Feb 15th, 2006
TDK has today launched its Belleta iSA Series of 1/16 Brick DC/DC Power Modules which provide better thermal performance than many eighth brick converters, in a much reduced footprint. The industry standard footprint (DOSA) DC-DC converters are ideal for engineers seeking to save space and cost in 48V distributed power architecture for telecom, datacom and many other applications.
NOVEMBER
Nov 22nd, 2005
TDK Factory Automation Systems will be demonstrating the TAS300 Load Port at Productronica 2005. The 300mm Wafer Load Port ensures a clean environment for wafer manufacturing by securely transferring wafers between parts of the manufacturing process. The Load Port automatically and securely opens and closes the FOUP (front opening unified port) to prevent exposure to dust, resulting in extremely low dusting characteristics. The moving components (including the mapping unit) are housed under the wafer surface, and complete airflow analysis has been carried out to achieve what is arguably the world’s best particle-free system.
OCTOBER
Oct 21st, 2005
- New iQB series addition, 12V/12.5A quarter brick DC-DC converter by TDK Innoveta offers the best cost-performance at this power level in the industry for single board open frame format-TDK Innoveta DC-DC range is now available from 3 new distributors.
Oct 5th, 2005
TDK Electronics Europe has introduced a new Flip Chip Bonder AFM-15, which offers all in one process for mounting and bonding for high precision applications. The AFM-15 offers significantly faster bonding at 1.1 seconds per chip (including bonding time), compared to the nearest comparable method of gold-wire bonding. The AMF-15 is targeted in particular to production of LEDs, RF-components and CSP’s or any other components, which profit from incorporating the benefits of this new bonding technology.
AUGUST
Aug 17th, 2005
TDK Electronics Europe has introduced a low loss ferrite material PC47, targeting the market for switching power supplies, adapters for notebook PCs and CCFL LCD backlights. The PC47 is ideal for the transformer applications due to its low core loss at wide frequency range of 100kHz to 300kHz.
JULY
Jul 26th, 2005
TDK Electronics Europe GmbH has introduced three new SMD Power Inductors, suitable for DC/DC converter usage in mobile applications. The company’s latest line of Power Inductors, spearheaded by the VLF 5014, provides a substantial size reduction whilst offering higher current handling - a response to growing customer demand.
Jul 25th, 2005
TDK Corporation today announced that it has signed an agreement to acquire London-headquartered Invensys plc.'s Lambda Power Division, which mainly develops, manufactures and sells power supplies, at a cost of approximately US$235 million (approx. ¥26.0 billion). Invensys plc. is listed on the London Stock Exchange.
JUNE
Jun 15th, 2005
TDK Electronics Europe GmbH has introduced two new chip ceramic resonators targeting the home appliance and industrial sectors. The CCR_MXC8 and CCR_MUC8 are designed for low frequencies, and offer high reliability even in tough environmental conditions.
Jun 14th, 2005
TDK Corporation today announces that it has completed the acquisition of Amperex Technology Limited ("ATL") (President: Dr. T.H.Chen, Headquarters: Hong Kong), a manufacturing and sales company of Polymer Lithium Battery, based in Hong Kong and having manufacturing sites in Dongguan, China.
Jun 14th, 2005
TDK corporation announces the availability of a total solution integrated UWB evaluation and measurement system.The total solution test system consists of wideband antennas, anechoic chambers, and software that speed up the process of compliance measurements. This automated test system performs the high precision measurements required as described by the FCC Rule Part 15 Subpart F UWB devices. A two-axis rotating structure and polarized automatic switching antennas are employed to measured emissions with the radiation patterns being displayed in three dimensions. The automated system, which is controlled via software developed at TDK, significantly reduces test time and increases the utilization of the test facility.
Jun 13th, 2005
TDK Innoveta Inc. announces the iQP-series product line, including 1.2V/100A, 1.5V/90A, and 1.8V/85A output models. These industry standard pin-out (Double-P) isolated DC-DC quarter brick converters offer ultra high usable current in tough environments.
APRIL
Apr 28th, 2005
TDK Innoveta Inc. expands the BelletaTM iQB series quarter brick DC-DC converter product line to include a 12V/12.5A (150W) output model, offering the best cost-performance tradeoff at this power level in the industry.
MARCH
Mar 22nd, 2005
TDK Corporation established internal product environmental assurance standards that include the six hazardous substances banned by the EU RoHS Directive set to go into effect in July 2006 along with additional substances independently banned by TDK and has successfully completed making general purpose electronic components conform to the RoHS Directive.
FEBRUARY
Feb 24th, 2005
TDK Electronics Europe has launched two new common mode filters specifically targeting the audio and video technology market. Both the ACM2012D/H-900-2P series and the TCM2010/1210 series are ideal for high-speed differential mode transmission, as they cause almost no distortion for high-speed signal lines. Both components also offer the advantages of very small size and full compliance with the RoHS directive.
NOVEMBER
Nov 9th, 2004
TDK Electronics Europe GmbH has launched its new BCS series of energy-saving visible ray optical sensors. The BCS sensors are suitable for controlling the brightness of liquid crystal displays of a wide range of electronic devices, including mobile telephones, PDA’s, digital cameras and in-car navigation systems.
Nov 9th, 2004
TDK Electronics Europe GmbH announces mass production of the world’s smallest series of multilayer chip beads, ideal for mobile telephones, where board space is becoming increasingly constrained.
OCTOBER
Oct 21st, 2004
The miniaturisation of mobile communications devices and the constant push towards higher frequencies has led to the demand for even higher performance coils. In response to this market need, TDK has improved its MLK and MLG series of multilayer ceramic coils. The MLG and the MLK series of coils now offer an extended inductance range of 1.0 nH to 33nH (MLK0603) and up to 100nH (MLG0603).
AUGUST
Aug 24th, 2004
The TPL series is ideal for automotive systems including tyre pressure monitoring systems, passive keyless entry devices and engine immobilisers.The TPL transponder coils offer high reliability and durability provided by a full moulding, which protects the coil during assembly.
JUNE
Jun 15th, 2004
With a tiny surface mount area of 2.6mm x 2.8mm and low profile of 1.0mm the VLF3010A power inductor, the smallest size inductor in the VLF family, is ideal for use in mobile phones and other portable devices where board space is constrained.
MAY
May 31st, 2004
With a diligent uncompromising regard to quality and reliability, TDK remains a world leader in factory automation. Flip Chip bonding machine and FOUP load port are the newest addition to our factory automation product line-up.
MARCH
Mar 15th, 2004
TDK Corporation announces that it has developed a series of 0603 type (0.6 mm x 0.3 mm x 0.3 mm) multilayer, high-impedance chip beads. Mass production begins in April 2004.
AUGUST
Aug 26th, 2003
TDK recently developed the PC95 ferrite core material for power supply transformer use with greatly reduced core losses over a wide temperature range (25°C to 120°C).
MAY
May 20th, 2003
TDK has successfully developed the industry's first color-filter type 4096 multicolor organic EL display that uses a passive matrix system.Volume production is scheduled to begin by the end of the year.
